Royce Die Sorters

Royce Instrument’s lineup of automatic and semi-automatic die sorters.

AP+ Automated Die Sorter

The AP+ marks the latest generation of automated die sorters by Royce. Designed to address the needs of engineers seeking a user-friendly, flexible tool capable of handling the most varied and complex sorting requirements. A highly flexible system capable of quickly changing between different inputs and outputs.

Quick change tooling allows a wide variety of processes to be handled on a single system. The non-surface contact edge grippers allow MEMs and optical devices with sensitive surfaces to be handled without touching or applying vacuum to the top of the device, while customizable eject heads and pick-up tools allow die as thin as 50 micron thick GaAs with air bridges and vias to be successfully processed. Integrated wafer mapping software allows wafers with multiple die sizes (multi-project/pizza mask wafers) to be easily processed. With the wafer map file support option, customers can load their map file directly into the AP+, or the built-in map creator can be used to create a map for untested wafers.

  • Product Densions and Facility Requirements

    • 2058 mm (81 in) long x 1105 mm (43.5 in) deep x 2235 mm (88 in) high (with cover open)

    • Compressed Air at 550 kPa to 690 kPa (80 to 100 psi), Vacuum at -65 kPa (20 in Hg) Electrical at 120-240 VAC ± 10%

  • Die Size Range

    • 0.2 mm sq to > 25 mm sq for tray placement, 0.5 mm sq to 17 mm sq for tape placement

    Die Input

    • Film frames

    • Grip/hoop rings (up to 300 mm diameter wafers)

    • Gel-Pak® (2 or 4 in.)

    • Waffle packs (2 or 4 in.)

    • JEDEC trays

    • Custom trays

    Pick-up Technology

    • Surface or top edge contact vacuum tips

    (rubber, Vespel, tungsten carbide, elastomer)

    • Optional non-surface contact Vespel edge grip

    Die Output

    • Carrier tape (8-24 mm tape width, heat seal

    or pressure seal)

    • Waffle packs (2 or 4 in.)

    • Gel-Pak® (2 or 4 in.)

    • JEDEC trays

    • Film frames

    • Grip/hoop rings

    • Custom

    Placement

    • ± 12.5 micron placement repeatability

    Die Sort Modes

    • Wafer mapping (SEMI E142, Electroglas 40x0,

    August Simplified INF, SEMI G85-0703, SEMI

    G85-1101, custom, create your own)

    • Ink dot recognition

    • Pick all die

    Throughput

    • Application dependent, 2 seconds minimum time per cycle

  • Choose from wafer on tape, waffle pack, Gel-Pak®, JEDEC tray or your own custom tray with or without a wafer map. 180 degree die inversion, optical inspection and a wide variety of output fixtures including placement to tape and reel are available. Full input to output die level traceability is maintained for all combinations of input and output fixtures

    Optional Add-ons

    • Die inverter

    • Post-place vision inspection of die in carrier tape

    • Top surface, bottom surface and edge inspection (application dependent)

    • Ionizer

    • HEPA filter

DE35-ST Semi-Automatic Die Sorter

The DE35-ST semi-automatic die pick and place system is a straightforward, low-cost machine for picking die from sawn or scribed wafters mounted on adhesive film. Die can be placed into waffle packs, Gel-Pak®, film frame, or directly onto substrates.

Optimized for small lot production, the DE35-ST is simple to learn and use. No hand tools are needed for die size changeover. Setup and option information is preserved in user-selectable recipes. Hundreds of catalog waffle pack parameters are preprogrammed with space for hundreds more user-programmed parameters.

Waffle pack pockets for die placement are automatically selected. Manual selection using the keypad arrow keys enables the completion of partially filled waffle packs.

  • Smallest Die Size: 200 µm

    Largest Die Size: >25 mm

    Largest Wafer 200 mm (pictured) 300 mm (large base)

    Die Placement: ± 120 µm

    Die Surface Load: <10 gf

    Throughput: 500 to 1200 UPH

    Electrical: 110-240 VAC, 50-60 Hz,

    Single phase

    Air: 275 k Pa to 550 kPa (40-80 psig)

    Vacuum: -65 kPa (20 in Hg)

    Weight: 93 kg, 205 lbs

    Width: 1120 mm, 44 in

    Depth: 840 mm, 33 in

    Height 660 mm, 26 in

  • • Excels in sorting fragile GaAs and MEMS devices

    • Available for up to 300mm wafers

    • Picks die as small at 200 µm square

    • Waffle pack, Gel-Pak® and film frame output

    • Underside and facet inspection options

    • Die inverter option

    • Throughput of 500-1200 UPH (product, process dependent)

    • Quick change over

  • Optional non-surface contact operation for MEMS, air-bridge GaAs, optical and other sensitive devices

    300mm input configuration